System provides effective method for TOC reduction in semiconductor applications
Siemens has introduced an effective method for removing total organic carbon (TOC) in point-of-use (POU) ultrapure water treatment systems for semiconductor applications.
This proprietary advanced oxidation process, referred to as the VANOX POU system, will consistently reduce TOC to 0.5 parts per billion (ppb) and can treat seasonal TOC variations in feedwater. This is important because TOC elevations above 1.0 ppb can directly affect the manufacturing process, significantly impacting product yields.
Advanced oxidation produces hydroxyl radicals that attack and break down difficult organic compounds measured as TOC. Although advanced oxidation has been used in industrial applications for years, it had not been refined enough to minimize key contaminants and thus improve various tool applications. The Siemens VANOX POU system has made improvements in the reactor design, allowing reductions in power and capital costs and reductions in chemical use.
“The Siemens VANOX POU system creates a more effective radical for TOC reduction compared to common AOP processes,” said Ultrapure Water Technical Manager for the Microelectronics Group at Siemens Water Technologies Bruce Coulter, “and it effectively removes troublesome organics such as urea, 2-propanol (IPA) and Trihalomethanes (THMs) found in semiconductor waters.”
The VANOX POU system will also deliver critical control temperature, low trace metal contaminates and reduce particles to less than 100 units per liter at .05 microns. The current industry standard for POU particle reduction is 200 to 500 units per liter.